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  3. Wire Bonding Process

Wire Bonding Process

  • Copper Wire

    BPO≥50
    BPP≥70
    AL layer thickness≥0.8um

  • Palladium-plated Copper Wire

    BPO≥50
    BPP≥70
    AL layer hickness≥0.8um

  • Alloy Wire

    BPO≥50
    BPP≥70
    AL layer thickness≥0.8um

  • Gold Thread

    BPO≥50
    BPP≥70
    AL layer thickness≥0.6um

  • Aluminum Wire/Strip

    BPO≥320*480
    BPP≥N/A
    AL layer thickness≥4um

About HSTC

About HSTC

Corporate Culture

Production Base

Wire Bonding Process

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Corporate Culture
We don't exaggerate or put on show; We do not easily promise to customers, once we make a commitment, we will go all out!
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Job Postings
The future and change starts here! It also makes you a colleague with great people.
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Contact Us
If you have any questions or suggestions, welcome to contact us!
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